PACK EXPO – CHICAGO

 

 

 

 

 

 

 

 

Fenco will be exhibiting in cooperation with ALLIEDFLEX Technologies Inc at PACK EXPO CHICAGO in Chicago from 14th to 17th October 2018, which will be held at Mccormick Place, Chicago, USA.

With a massive floor showcasing machinery in action, and plenty of packaging solutions, this show certainly will not disappoint. Not only will it provide you with everything you need within this sector, but if you arrive looking for ideas, you will most definitely leave with solutions.

Please come by to see us (Booth S-2267)

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